Solder balls during the soldering process are a primary cause of rework and inspection complications, especially in fine-pitch applications.  Our ZSB feeder system eliminates those issues by combating solder ball formation from the start.

This wire feeder can control feeding amount precisely via its pulse motor.  It can also be upgraded with the ZSB roller blade as an optional attachment to prevent solder balls and flux spattering.

The SSA system is designed for use in automated environments such as filling solder pots automatically, feeding solder for copper joints, flame applications etc.  If used to control the solder liquid surface level, it automatically keeps the level constant.