Featuring Zero Solder Ball Technology...
Exclusive Apollo Seiko ZSB feeding technology allows for the elimination of soldering defects by pre-perforating solder wire to allow for better out-gassing of the flux core.
Our built-in roulette cutting blade makes evenly spaced holes while precisely feeding solder wire. During soldering, the flux is released evenly through these holes. This provides consistent flux coverage without messy spattering and allows solder to melt on a clean, active surface.
Watch our ZSB in action >>>
Solder balls during the soldering process are a primary cause of rework and inspection complications, especially in fine-pitch applications. Our ZSB feeder system eliminates those issues by combating solder ball formation from the start.
This wire feeder can control feeding amount precisely via its pulse motor. It can also be upgraded with the ZSB roller blade as an optional attachment to prevent solder balls and flux spattering.
This unit increases the efficiency of manual solder work. “Handling the iron unit” and “Feeding the solder” are two actions that can be done with one hand. The iron units can come in either pen or pistol type.
The SSA system is designed for use in automated environments such as filling solder pots automatically, feeding solder for copper joints, flame applications etc. If used to control the solder liquid surface level, it automatically keeps the level constant.