Laser Soldering

LASER SOLDERING

Premiering the J-cat MLU-808F

 

How Laser Soldering Works And Why You Should Be Interested

Laser soldering is a non-contact process that eliminates the risk of marring or damaging sensitive components.  Robots are capable of producing micro-sized laser beams for otherwise difficult applications too small for iron tip soldering.  Our advanced optical technology provides a reliable solution for micro and narrow pitched parts used in high-density electronic equipment.  

The laser soldering process depends on the type of solder to be used (wire, pre-form or paste). In the case of solder wire, laser irradiation is performed in advance to the joint area (pre-heating). This is the most important process in order to wet and allow the solder to flow easily when supplying the solder wire to the joint area.   

 

J-CAT MLU-808FS/ MLU-980FS

Our Desktop Laser-Soldering Robot

This robot is non-contact soldering that heats up the target with a high energy light emitted from an oscillated laser diode and is focused with a lens.  Wavelength can be either 808nm or 980nm, varying between models.


Type MLU-808FS MLU-980FS
Material Semiconductor Laser
Oscillation CW (Continuous Wave)
LD Type
Fiber Coupling
LD Output
50W
Wavelength 808 nm
980 nm
Guide Beam
Included
Halation Prevention
Included
LD Cooling System
Electric Cooling
Coaxial Observation Function
Included
Fiber Core Diameter
φ200μm
φ400μm
Fiber Length
3m
Focused Beam Diameter
φ50μm~8000μm
Focal Length
10mm ~ 200 mm (actual focal length may vary based upon beam diameter.)
Focused Beam Shape
Circular, rectangular, or free shape option via SLIT laser
Temperature Control
Available
Parameter Control Mode
Time Setting Resolution
0.1 sec
0.01 sec
STEP
1~100 STEP
Time Setting
1 STEP = 0.1 sec. (Max: 0.1sec. ×100STEP = 10sec.)
Current (A) Control
Setting Resolution
0.1A
Registered Waveform Capacity
16
Interface Input Terminal x 1; Sig. OUT (BNC) x 1; CURR. MINI (BNC) x 1; RS232 x 1; Analog Input (0~5V) x 1
Dimensions WxDxH
Laser Head
160.5 x 114 x 366 mm (Max size)
Laser Oscillation Unit
270 x 260 x 230 mm
Laser Controller
430 x 350 x 149 mm
Weight Laser Head
Approx 1 kg
Laser Oscillation Unit
Approx 6.5 kg
Laser Controller
Approx 16 kg
Power Single Phase AC100V
AC220V ± 10% 50/60 Hz


SLIT Beam.jpg

 

 

 

 

Slit Beam: Laser-Shaping Technology Option

Although the laser beam shape is generally circular, this originally developed SLIT plate (metal plate with a hole) enables virtually any type of laser beam shape. Since the beam shape can be conformed to the part shape, damage to adjacent parts is greatly reduced.  

 

Banner.jpg

Dispensing

Solder Paste Dispensers

Achieve ultimate small volume stability with precision nozzels.  Dispensing technology provides an alternative to the classic wire feed approach.  Dispensers allow for a precise amount of solder paste to be evenly distributed in micro amounts.  This approach eliminates waste and increases cost effectiveness.  

 


laser_lenses.jpg

Laser Lenses


Lenses

The type of lens to form a laser beam is composed of two components, the “Input lens” and “Output lens”. With the combination of these lenses, over 100 diameter variations can be achieved.



The TCU-1000 Optional Unit

This non-contact radiation thermometer measures the temperature of the soldering point in real time. Select it from the accessories listing below to learn more about how it can keep your laser machine stable.

Temperature Control


Additional Accessories: What else can you customize?